E220-M Series, LoRa Spread Spectrum Wireless Module E220-400M22S
E220-400M22S
[IC]：LLCC68
[Frequency]：410.125~493.125MHz
[Power]：22dBm
[Distance]：6km
[Size]：20*14*2.8mm
[Introduction]：E220-400M22S is an small module developed independently based on the generation of LoRa TM RF chip LLCC68 produced by Semtech company. LLCC68 is suitable for 433MHz and 470MHz SMD wireless module and uses industrial 32mhz crystal oscillator.
| Model | Communication interface | IC | Frequency(Hz) | Tx power(dBm) | Distance(km) | Air data | Package | Size(mm) | Feature | Manual |
| E220-400M22S | SPI | LLCC68 | 433M 470M | 22 | 6 | 1.76~62.5k/0.6~300k | SMD | 20*14*2.8 | New generation LoRa modulation technology | ✔ |
| E220-400M30S | SPI | LLCC68 | 433M 470M | 30 | 10 | 1.76~62.5k/0.6~300k | SMD | 38.5*24 | New generation of LoRa spread spectrum technology | ✔ |
| E220-900M30S | SPI | LLCC68 | 868M 915M | 30 | 10 | 1.76~62.5k/0.6~300k | SMD | 38.5*24 | New generation of LoRa spread spectrum technology | ✔ |
| E220-900M22S | SPI | LLCC68 | 868M 915M | 22 | 6 | 1.76~62.5k/0.6~300k | SMD | 20*14*2.8 | New generation LoRa modulation technology | ✔ |
| Main parameter | Performance |
Remark |
| Operating frequency |
410~493MHz | Support ISM band |
| Tx power | 22 dBm | - |
| Receiving sensitivity | -129dbm |
- |
| Air data rate | 1.76k~62.5kbps | User programming control |
| Distance for reference | 5.5km | Test condition：clear and open area, antenna gain: 5dBi，antenna height: 2.5m，air data rate: 2.4kbps |
| Main parameter | Performance |
Remark |
| Size |
20* 14*2.8 mm |
- |
| RF interface |
IPEX/stamp hole | - |
| Communication interface | SPI |
0-10Mbps |
| Package | SMD | - |
| Main parameter | Min. | Typ. | Max. | Unit | Remark |
| Operating voltage |
1.8 | 3.3 | 3.7 | V | ≥3.3V ensures output power |
| Communication level | - | 3.3 | - | V | For 5V TTL, it may be at risk of burning down |
| TX current | - | 100 | - | mA | Instantaneous power consumption |
| RX current | - | 6.5 | - | mA |
- |
| Sleep current | - | 180 | - | uA | Software shutdown |
| Operating temperature |
-40 | 20 |
+85 | ℃ | Industrial design |
| Pin No. |
Item | Direction | Description |
| 1 | GND | - |
Ground, connect to power reference ground |
| 2 | GND | - |
Ground, connect to power reference ground |
| 3 | GND | - |
Ground, connect to power reference ground |
| 4 | GND | - |
Ground, connect to power reference ground |
| 5 | DIO3 |
- |
Configurable universal IO port (see llcc68 manual for details) |
| 6 | RXEN |
input |
RF switch receive control pin, connect external MCU IO, high level effective |
| 7 | TXEN |
input |
RF switch emission control pin, connected to external MCU IO or dio2, high level effective |
| 8 | DIO2 |
Input / output |
Configurable universal IO port (see llcc68 manual for details) |
| 9 | VCC |
- |
Power supply, range 1.8V ~ 3.7V (it is recommended to add ceramic filter capacitor externally) |
| 10 | GND |
- | Ground, connect to power reference ground |
| 11 | GND | - |
Ground, connect to power reference ground |
| 12 | GND |
- |
Ground, connect to power reference ground |
| 13 | DIO1 |
Input / output |
Configurable universal IO port (see llcc68 manual for details) |
| 14 | BUSY |
output |
For status indication (see llcc68 manual for details) |
| 15 | NRST |
input |
Chip reset trigger input pin, low level effective |
| 16 | MISO |
output |
SPI data output pin |
| 17 | MOSI |
input |
SPI data input pin |
| 18 | SCK |
input |
SPI clock input pin |
| 19 | NSS |
input |
The module chip selection pin is used to start a SPI communication |
| 20 | GND | - |
Ground, connect to power reference ground |
| 21 | ANT | - |
RF interface, stamp hole |
| 22 | GND | - |
Ground, connect to power reference ground |
